Aluminum nitride product / ALN substrate

Aluminum nitride product / ALN substrate

Product ALN substrate
Material Aluminum nitride
Processing Method Polished by Rotary Grinding Machine
Size 350 x 5 mm (T), Flatness tolerance: 0.01 mm
Application Devices for semiconductor-manufacturing equipments Ex. The dummy wafer or electrostatic chucks
Description Aluminum nitride has properties of  high heat resistant, high heat conductivity, excellent heat equalization and electrical insulation. ALN substrate film is used for mainly semiconductor manufacturing devices, and also it can be used for vacuum evaporation system, sputtering machines and CVD devices.

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