High Purity 99.9% SiC Tray

High Purity 99.9% SiC Tray

 
Product High Purity 99.9% SiC Tray
Material 99.9% SiC
Processing Method Grinding and CNC Machining
Size Diameter φ200 x Thickness 0.5mm
Application Wafer Tray for Semiconductor CVD Etching
Description

Flow from inquiry to production

We handle all request methods, from drawings to already existing products.

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Request with a drawing

Request with already existing product

Request with already existing product

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Request with specification

TEL.0749-51-9021

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Headquarters and plant

1197-4, Hosoe-cho, Nagahama City, Shiga, 526-0105 Japan
Phone: +81-749-51-9021
Fax: +81-749-51-9022
info@top-seiko.co.jp