MMC(SiSic)
Si-SiC Diffusion Bonding
| Product Name | Si-SiC Diffusion Bonding |
|---|---|
| Material | Si-SiC |
| Process | Groove Shape by Diffusion Bonding, Deep Hole Formation |
| Remarks |
Diffusion bonding enables joining different shapes without intermediate materials. Maintains base material properties while enabling shapes difficult by machining. This technology enables integration of deep holes, internal channels, and channel branching into a single structure. It maintains the same size as conventional parts while providing unique functionality Enables complex and multi-functional structures for various applications ■Pre-Bonding Shape Image (Outer Size):φ300 ①Groove Component Groove for Side Holes (Max Depth Approx. 290 mm)  ②Cover Component Covers groove and forms slit bottom  ③Slit Component Slit that becomes groove after bonding  ■Post-Bonding Shape Image (Partial cross-section with 300 mm rod)  ■Actual Sample Image · Groove (Post-processing available)  · Side hole (φ0.65 × Length 300 mm rod inserted) ＊Long hole formation available  ■Concept Image Additional channel formation by bonding cover material 
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