Applications by Material

Ceramics

  • Alumina (Al₂O₃)
    Electrical Insulation, Heat Resistance, Good Machinability
    Diffusion Bonding Available
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  • Aluminum Nitride (AlN)
    High Thermal Conductivity, Heat Resistance, Electrical Insulation, Low Thermal Expansion, Plasma Resistance, Chemical Resistance
    Diffusion Bonding Available
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  • Zirconia (ZrO₂)
    High Toughness, Wear Resistance, Low Thermal Conductivity
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  • Silicon Carbide (SiC)
    High Hardness, High Rigidity, High Thermal Conductivity, Corrosion Resistance
    Diffusion Bonding Available
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  • MMC (SiSiC)
    High Rigidity, Low Thermal Expansion, Heat Resistance
    Diffusion Bonding Available
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  • Silicon (Si)
    Contamination-Free (Same Material as Wafer), Controlled Electrical Resistivity
    Diffusion Bonding Available
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  • Various Machinable Ceramics
    Electrical Insulation, Heat Resistance, Good Machinability
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Refractory Metals

  • Molybdenum (Mo)
    Heat Resistance, High Thermal Conductivity, Low Thermal Expansion
    Diffusion Bonding Available
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  • Tungsten (W)
    Heat Resistance, High Thermal Conductivity, Low Thermal Expansion, High Density
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  • Tantalum (Ta)
    Corrosion Resistance, Heat Resistance, Machinability
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  • Niobium (Nb)
    Heat Resistance, Superconductivity, Corrosion Resistance, Biocompatibility
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Special Metals

  • Nickel Alloys (Ni)
    Corrosion Resistance, Heat Resistance
    Diffusion Bonding Available
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  • Titanium (Ti)
    High Strength, Lightweight, Machinability, Corrosion Resistance, Biocompatibility
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Glass

  • Quartz Glass / Heat-Resistant Glass
    Heat Resistance, Low Thermal Expansion, Electrical Insulation, Chemical Resistance
    Diffusion Bonding Available
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  • Sapphire (Al₂O₃)
    Transparency, High Hardness, High Strength
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