Exemples d'usinage

Si-SiC diffusion bonding

Product Si-SiC material Diffusion bonding
Material Si-SiC
Processing Method Difussion bonding of a Si-SiC plate



The diffusion bonding process we are developing can  join members of different shapes without using intermediate materials.

The appeal of this technology is that it can create shapes that are difficult to machine while maintaining the characteristics of the base material.

This technology makes it possible to combine unique characteristics into a single structure by (1) deep hole shape, (2) internal flow channels, (3) addition or division of flow channels, etc., although the size is the same as that of conventional parts.

This technology contributes to the achievement of complex and multifunctional shapes required for various applications.


■ Image of shape before joining                        * Outside size: φ300

① Grooved layer

Machining a groove as a side hole (290mm at the deepest point)

(Assumed to be 290mm at the deepest point)

first strate for the diffusion bonding material

② Cover layer

Cover of the groove layer 

Cover layer

③ Slit layer

Slit to be used as a groove after bonding


Slit layer of a diffusion bonding part


■ Illustration of shape after bonding                                             *Some cross sections are shown to reveal the deep hole.


Illustration of a bonding part with grooves and holes


■ External image of actual sample


  Additional work is possible after joining


Final groove illustration


・Side hole  * A rod of 0.65 mm dia. x 300 mm in length is inserted.

 (Same length as the image above)

 *Possible to create a long hole 


Side long hole illustration of a diffusion bonding part


■ Final developed product illustration 

    In addition, by joining the lid material, the flow path can be freely formed.


Final product illustration



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