Aluminum nitride product / ALN substrate

Product	ALN substrate
Material	Aluminum nitride
Processing Method	Polished by Rotary Grinding Machine
Size	350 x 5 mm (T), Flatness tolerance: 0.01 mm
Application	Devices for semiconductor-manufacturing equipments Ex. The dummy wafer or electrostatic chucks
Description	Aluminum nitride has properties of high heat resistant, high heat conductivity, excellent heat equalization and electrical insulation. ALN substrate film is used for mainly semiconductor manufacturing devices, and also it can be used for vacuum evaporation system, sputtering machines and CVD devices.

Aluminum nitride product / ALN substrate - Mechanika Precyzyjna Ceramiki i Metale Ogniotrwałe | Top Seiko Co.,Ltd.