Machining Examples

High Purity 99.9% SiC Tray

Product High Purity 99.9% SiC Tray
Material 99.9% SiC
Processing Method Grinding and CNC Machining
Size

Diameter φ200 x Thickness 0.5mm
Application

Wafer Tray for Semiconductor CVD Etching
Description
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Węglik krzemu(SiC)Machining Examples

  • SiC Empossed machining example

  • High Purity 99.9% SiC Tray

  • SiC tray

  • SiC susceptor

  • SIC square shape tray

  • SiC filter

  • SiC cap

  • SiC ring

  • SiC disk