Driving Innovation with Technology

Core Technologies

Precision Machining and Diffusion Bonding of Advanced Materials

Since its founding, Top Seiko has supplied critical components requiring extremely tight tolerances to equipment manufacturers across a wide range of industries, including semiconductor, aerospace, electronics, and automotive. Our core technologies are precision machining of advanced materials and diffusion bonding. We have extensive experience in machining advanced ceramics as well as refractory metals such as molybdenum and tungsten.

Precision Machining
of Advanced Materials

We possess a broad range of specialized technologies that enable us to machine advanced materials—including ceramics, refractory metals, and quartz glass—into complex, high-precision geometries exactly as required.

Diffusion Bonding

Through advanced diffusion bonding technology, materials are joined in the solid state—without melting—by atomic-level diffusion. This enables the creation of highly reliable, high-performance components and supports innovation across advanced industries.

Applications by Material

We present machining examples of sample components manufactured by Top Seiko, organized by material. We invite you to explore these examples as a reference for your applications.

Ceramics

  • Alumina (Al₂O₃)
    Electrical Insulation · High Strength · Heat Resistance · Wear Resistance · Plasma Resistance · Chemical Resistanc
    Compatible with Diffusion Bonding
  • Aluminum Nitride (AlN)
    High Thermal Conductivity · Heat Resistance · Electrical Insulation · Low Thermal Expansion · Plasma Resistance · Chemical Resistance
    Compatible with Diffusion Bonding
  • Zirconia (ZrO2)
    High Fracture Toughness · Wear Resistance · Low Thermal Conductivity
  • Silicon Carbide (SiC)
    High Hardness · High Stiffness · High Thermal Conductivity · Corrosion Resistance
    Compatible with Diffusion Bonding
  • SiSiC (Silicon-Infiltrated Silicon Carbide)
    High Stiffness · Low Thermal Expansion · Heat Resistance
    Compatible with Diffusion Bonding
  • Silicon (Si)
    Contamination-Free (Wafer-Equivalent Material) · Controlled Resistivity
    Compatible with Diffusion Bonding
  • Machinable Ceramics
    Electrical Insulation · Heat Resistance · Excellent Machinability

Refractory Metals

  • Molybdenum (Mo)
    High-Temperature Resistance · High Thermal Conductivity · Low Thermal Expansion
    Compatible with Diffusion Bonding
  • Tungsten (W)
    High-Temperature Resistance · High Thermal Conductivity · Low Thermal Expansion · High Density
  • Tantalum (Ta)
    Electric Insulation・High-Temperature Resistance · Good Machinability
  • Niobium (Nb)
    High-Temperature Resistance · Superconducting Properties · Corrosion Resistance · Biocompatibility

Advanced Metals

  • Nickel (Ni)
    Corrosion Resistance · High-Temperature Resistance
    Compatible with Diffusion Bonding
  • Titanium (Ti)
    High Strength · Lightweight · Good Machinability · Corrosion Resistance · Biocompatibility

Glass

  • Quartz Glass / Heat-Resistant Glass
    High-Temperature Resistance · Low Thermal Expansion · Electrical Insulation · Chemical Resistance
    Compatible with Diffusion Bonding
  • Sapphire (Al₂O₃)
    Optical Transparency · High Hardness · High Strength

Development Support

Contributing to our customers’ new product development
through two core technologies

Precision machining of difficult-to-machine materials and diffusion bonding.
By leveraging these two core technologies to supply custom mechanical components, we create new value for industries around the world.
Our extensive inventory of materials, a wide range of machining equipment, and the technical expertise built on the experience of skilled engineers enable us to support the rapid launch of our customers’ new product development.

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