High Purity 99.9% SiC Tray
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Product | High Purity 99.9% SiC Tray |
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Material | 99.9% SiC |
Processing Method | Grinding and CNC Machining |
Size | Diameter φ200 x Thickness 0.5mm |
Application | Wafer Tray for Semiconductor CVD Etching |
Description |
Product | High Purity 99.9% SiC Tray |
---|---|
Material | 99.9% SiC |
Processing Method | Grinding and CNC Machining |
Size | Diameter φ200 x Thickness 0.5mm |
Application | Wafer Tray for Semiconductor CVD Etching |
Description |