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Aluminum nitride product / AlN substrate
| Product | AlN substrate |
|---|---|
| Material | Aluminum nitride |
| Processing Method | Polished by Rotary Grinding Machine |
| Size | 350 x 5 mm (T), Flatness tolerance: 0.01 mm |
| Application | Devices for semiconductor-manufacturing equipments Ex. The dummy wafer or electrostatic chucks |
| Description | Aluminum nitride has properties of high heat resistant, high heat conductivity, excellent heat equalization and electrical insulation. AlN substrate film is used for mainly semiconductor manufacturing devices, and also it can be used for vacuum evaporation system, sputtering machines and CVD devices. |
