Back side of nickel-bonded product 【Under development】

+81-(0)749-51-9021 info@top-seiko.co.jp

Machining Examples

Product	Back side of nickel-bonded product
Material	Pure Nickel (Ni)
Processing Method	Difussion bonded
Size	Outer diameter: φ310mm Hole diameter: φ0.8 Number of holes: 525 holes
Application
Description	There are countless small diameter holes on the back. The three nickel plates are processed separately and then joined together.

Contact

Back side of nickel-bonded product 【Under development】 - Top Seiko Co,. Ltd.