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High Purity 99.9% SiC Tray
| Product | High Purity 99.9% SiC Tray |
|---|---|
| Material | 99.9% SiC |
| Processing Method | Grinding and CNC Machining |
| Size | Diameter φ200 x Thickness 0.5mm |
| Application | Wafer Tray for Semiconductor CVD Etching |
| Description |
Machining Examples
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High Purity 99.9% SiC Tray - Top Seiko Co,. Ltd.
